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Posted By admin On 13.11.18As a gamer, [Lexie Dostal] dreamed of a smartphone that was a viable gaming platform: something with enough power to run the games and emulators he was interested in, with the controls to make playing them feel natural. So when he got his hands on an early version of Kite, the modular open hardware platform designed to be hacked and customized,. The Kite kit would provide the touch screen and Android-equipped motherboard, he just needed to design a case and integrate controls to make it a real gaming device. The case design [Lexie] came up with is inspired by the bottom half of the Nintendo 3DS, and ended up only a few centimeters wider than the stock case from the Kite kit. Unfortunately, his delta 3D printer wasn’t large enough to fit the device’s case, so he ended up having to break it into five separate pieces and glue them together. With the case in one piece he worked his way from 220 to 400 grit sand paper, filling any voids in the print with glue as he went. Stage plot template.
A few coats of primer, more sanding, and a final matte texture spray give the final case a very professional-looking finish. Not only was the Nintendo 3DS an inspiration for the device, it was also a donor for some of the parts. The directional pad, analog “nub”, and buttons are replacement 3DS hardware, which is interfaced to the KiteBoard with an Arduino Nano. When he couldn’t find springs small enough to use for the shoulder buttons, he bought some thin music wire and wound them himself. Talk about attention to detail. There’s quite a bit of gear packed into the case, but [Lexie] thinks there’s probably still room to make some improvements.
Ibm spss activation code. May 25, 2008 List of the best Rom hacks!!! Discussion in 'General Gaming Discussion' started by Eternal Myst, May 24, 2008. Run commercial NDS backups from an SD Card. Robz8 - Jan 1, 2019 at 4:19 AM [4.74 HEN RELEASED] Payloads and information thread. Faisalhudz - Jan 1, 2019 at 4:17 AM. Discover the most played and best Pokemon ROM Hacks of the year based on mentions, downloads, game ratings and recommendations from real users. Without a doubt, the internet has given plenty of opportunities to passionate individuals to express their feelings and sharing their creativity through great creations. Coming up with a list of the top 15 Super Mario Rom Hacks was not an easy task. The hacks ranked are from different game consoles and different Mario games. Deciding which hack is better than the other, is not easy.
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He could free up some room by dropping the connectors and soldering everything directly, and says he’d like to come up with a custom PCB to better interface with the 3DS’s hardware to cut down on some of the wiring required. With the extra room he thinks the battery, currently a 3200 mAh pack designed for the LG V20 smartphone, could probably be replaced with something even bigger. Readers may recall that the Seeing Kite already delivering on the promise of making it easier to develop powerful Android devices is very exciting, and we can’t wait to see what else hackers will be able to do with it. Posted in,, Tagged,,. For the last five years or so, Nintendo has been selling the 3DS, the latest in a long line of handheld consoles. Around two years ago, Nintendo announced the New Nintendo 3DS, with a faster processor and a few other refinements.
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The new 3DS comes in two sizes: normal and XL. You can buy the XL version anywhere in the world, but Nintendo fans in North America cannot buy the normal version. [Stephen] didn’t want the jumbo-sized New 3DS XL, both because it’s too large for his pockets, and because there are no fancy cases for the XL. His solution?.
In manufacturing the XL and non-XL versions of the 3DS, Nintendo didn’t change much on the PCBs. Sure, the enclosure is different, but electronically there are really only two changes: the eMMC storage and the Nintendo processor. 3DS are region-locked, so simply swapping out the boards from a normal 3DS to an XL 3DS wouldn’t work; [Stephen] would also like to play US games on his modded console. That leaves only one option: desoldering two chips from a US XL and placing them on the board from a Japanese 3DS. With a board preheater and heat gun, [Stephen] was able to desolder the eMMC chip off both boards. Of course this meant the BGA balls were completely destroyed in the process, which means reballing the package with solder bits only 0.3mm in diameter.
With the US eMMC transplanted to the Japanese board, [Stephen] ended up with an error message that suggested the processor was reading the memory. Progress, at least. [Stephen] then moved on to the processor. This was a nightmare of a 512 pin BGA package, with 512 pins that needed a tiny dot of solder placed on them.